Products

PCB Specifications

  • Number of board layers: Typical 1 to 16 layers
  • Typical board size: 25" x 16"
  • Board thickness:
  • Single side: .039", .059", .078"
  • Double-sided: 0.020", 0.031", .039", .047", .062", .078", .094", .118"
  • Maximum board thickness (multilayer board): 0.130"
  • Tolerance of standard board thickness: (+/-10%)
  • Base materials: FR-4, FR-406, FR-408, FR-5,
  • Copper foil: 0.5 oz, 1 oz, 2 oz, 4 oz, 6 oz
  • Minimum conductor width: 0.004" (0.1 mm)
  • Minimum conductor spacing: 0.004" (0.1 mm)
  • Minimum finished hole size: 0.008" (0.2mm)
  • Silkscreen/Legend colors: white, yellow, black
  • Solder Mask: Wet Film, LPI (Liquid Photo-Imageable). Colors: Green, Black, Red, Blue
  • Maximum hole aspect ratio: 8:1

Plating Types:

  • Tin/Lead HASL
  • Immersion gold (soft gold)
  • Immersion nickel
  • Ectrolytic gold (hard gold)
  • Immersion tin
  • OSP
  • Selective hard coated gold (30 micro inches min.) over nickel (between 150 & 250 micro inches) as per ASTM-B-488

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Standard specifications:

  • Soldering of electronic components must be in accordance with IPC-A-610c class II Latest Revision
  • MIL-PRF-31032, Performance Specification Printed Circuit Board/Printed Wiring Board
  • MIL-PRF-55110, Performance Specification for Rigid Printed Circuit Board/Printed Wiring Board
  • MIL-PRF-50884, Performance Specification for Flexible and Rigid-Flexible Printed Circuit Board/Printed Wiring Board
  • Performance Specification Printed Circuit Board/Printed Wiring Board, General Specification for (w/Amendment 1) FSC 5998

The material must conform to:

  • BS4584:1972 part 3, type EP-GC-CU-3, close tolerance thickness, or
  • NEMA-L1-1-1965 Grade FR4 General purpose flame resistant material; Class 2 thickness tolerance, or
  • NEMA-L1-1-1965 Grade FR5 General purpose temperature and flame resistant material; Class 2 thickness tolerance.

Testing:
Unpopulated boards are subjected to a bare-board test where each circuit connection (as defined in a netlist) is verified as correct on the finished board. For larger volumes, custom test fixtures such as incircuit test fixtures (ICT) will be used to facilitate testing. For small to medium volume boards, flying-probe testers may be used.

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