Description/General Specifications
Overview | Description/General Specifications | PCB Specifications | Flex Circuit

Printed Circuit Boards (PCB) are used to both mechanically support and electrically connect electronic components by either surface mount (SMT) or though hole assembly using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate.
Alternative names are:
- Printed wiring board's (PWB)
- Etched wiring board
- Switchboard
After populating the board with electronic components, a printed circuit assembly (PCBA) is formed. This PCBA subassembly will become an integral layer in a GGI manufactured User Interface Assembly.

GGI International's PCBs are rugged, cost effective and highly reliable. The majority of PCBs range from between one to sixteen conductive layers made of FR4 separated and supported by layers of insulating material (substrates) laminated (glued with heat, pressure & occasionally vacuum) together. Layers may be connected together through drilled holes called vias. The holes are either electroplated or small rivets are inserted. High-density PCBs may have blind vias, which are visible only on one surface, or blind and buried vias, which are visible on neither surface.
RoHS and Lead (Pb) Free compliance: GGI International manufactures and ships products in conformity with the most recent international standards and regulations; in America, Europe or elsewhere in the world.
The following specifications are required to meet RoHS compliancy:
- Requires printed circuit boards manufactured using raw substrate materials that will support the use of Lead-free solder processes for component assembly.
- Surface finishes to be applied to the printed circuit board to be RoHS compliant as well as Lead-Free Assemblies.
- Silkscreen and solder mask materials must withstand 260°C.
- PCB Laminates and prepared materials must also withstand 260°C for lead free assembly.
- RoHS compliancy not only means lead-free but also includes meeting all the specified concentration levels for mercury (Hg), cadmium (Cd), hexavalent chromium (Cr(VI)), polybrominated biphenyls (PBB) and polybrominated diphenyl ethers at the homogenous level (PBDE).
Lead-free PCB Finish Options able to withstand temperatures of 260°C and above are:

- ENIG (Electroless Nickel Immersion Gold)
- Electrolytic Ni/Au
- Immersion Silver
- Immersion Tin
- OSP (Organic Surface Preservative)
- Soft Wire-Bondable Gold
Note: All soldermask colors are RoHS compliant.
PCB DESIGN DATA:
For each individual program requiring PCB design, GGI International's engineering team has the ability to generate the following items upon request:

- BOM (Bill of Material)
- AVL (Approved Vendor List) including at least;
- Reference designator such as U1, R3
- Quantities
- Manufactured part numbers
- Foot prints including package shapes & sizes
- Values
- Complete Gerber and Pick & Place files if automated placement is required
Overview | Description/General Specifications | PCB Specifications | Flex Circuit